Pepper Gray Technology (PGT)

Cumulative Output: 126552804Pieces

PGT is the only privately-owned company with industrial laser submounts as its core business. It is a highly focused and specialized enterprise dedicated to addressing the “three high” challenges (high heat, high voltage, high frequency) in chip packaging. The company provides high performance electronic ceramic products to customers worldwide.

ABOUT US

Pepper Gray Technology (PGT) was established in August 2021, with a registered capital of RMB 85,623,618 and a cumulative investment of RMB >300,000,000. The headquarters is located in Dongguan Songshan Lake International Innovation and Entrepreneurship Community, and the DPC factory is located in Shenzhen Bao'an District Jiangbi Environmental Protection Technology Innovation Industrial Park. Focusing on solving the “three-high” issues of chip packaging - High Heat, High Voltage and High Frequency, PGT provides electronic ceramic solutions with outstanding performance to global customers.

12360.42m²

Factory Area 12360.42m²
5 M

5 Million Pcs (Industrial Laser Heat Sinks)
100 M

100 Million Pcs (Optical Communication & Consumer Electronics Heat Sinks)
>300 M

Cumulative Investment >300 Million CNY

PRODUCTS

PGT has a fully self-reliant and controlled process platform and mass production line, encompassing submount design, ceramic pre-processing, PVD thin film processes, precision electroplating, photolithography and etching, high-precision grinding and polishing, packaging, and testing. It has achieved self-reliance in core materials and critical equipment. The company has built the world's latest mass production line dedicated to laser submounts, offering leading production capacity and cost advantages, along with rapid prototyping services.

PGT boasts a team of top scientists and engineers from Europe, Japan, Taiwan, and Mainland China, providing a solid foundation for innovation and technological leadership. This enables PGT to achieve rapid product iteration, delivering excellent product performance while maintaining cost competitiveness and flexible supply capabilities.

TECHNICAL CAPABILITY: Fifteen Core Technologies
Providing contract manufacturing services for various technologies.

PVD (Ceramic Metallization)

Magnetron Sputtering is a Physical Vapor Deposition (PVD) technology. Plasma confined by a magnetic field bombards the target material, ejecting atoms that are subsequently deposited onto the substrate surface to form a thin film, enabling high-quality ceramic metallization.
Thick Copper Electroplating

Metal is deposited through an electrochemical process to build up a thick metal layer, providing excellent thermal performance, electrical conductivity, and mechanical properties.
Nickel/Gold Electroplating

Nickel and gold layers are deposited through an electrochemical process. The resulting Ni/Au coating provides excellent corrosion and wear resistance, extending product service life while delivering superior solderability and reliability.
Planarization

Grinding and polishing processes are applied to optimize the flatness and surface roughness of the copper layer, providing a high-quality mounting surface for chip packaging.

1. Flatness: <2μm

2. Nanometer-level mirror surface finish achievable
Vacuum Evaporation (Pre-Applied AuSn Solder)

Evaporation / Vacuum Evaporation is a Physical Vapor Deposition (PVD) technology. Under high-vacuum conditions, the source material is heated until it vaporizes. The vaporized atoms or molecules are transported to the substrate surface and condensed to form a thin film.
Wet Pattern Transfer (Developing, Etching & Stripping – DES)

Wet chemical processes are used to develop, etch, and strip the photoresist after exposure, transferring the designed pattern onto the thin-film metallization layer to form the required circuit pattern.
Photoresist Patterning (Pattern Transfer)

Photoresist patterning is a core semiconductor manufacturing process that precisely transfers circuit patterns from a photomask onto a wafer or substrate surface. The process is fundamentally based on a photochemically induced change in photoresist solubility.
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