Structural Design & Simulation Analysis

Customized Design Based on Chip and Packaging Applications

Based on customer requirements including chip dimensions, power density, bonding method, package structure, and operating conditions, PGT develops customized designs for submount patterns, metallization structures and thicknesses, positioning features, soldering areas, and other critical features.

Thermal Performance & Packaging Stress Simulation

Thermal conduction analysis, thermo-mechanical coupled analysis, and finite element analysis (FEA) are applied to evaluate submount structures and chip packaging systems. Simulation results guide material and structural design selection, while actual COS assembly is used for validation and refinement, establishing a closed-loop Design → Simulation → Validation → Optimization development process.

COS Assembly & Application Evaluation

Customer chips are assembled directly onto PGT submounts to evaluate product structure, metallization, bonding interfaces, and thermal performance under actual application conditions.

The evaluation focuses not only on whether the submount meets drawing specifications, but also on its actual compatibility with the customer's chips, solder materials, and packaging processes.

COS evaluation results are fed back into structural, material, metallization, and process optimization, reducing development risks associated with reliance solely on simulation or single-round prototyping and improving compatibility with customers' actual packaging lines.

Material Characterization & Selection

PGT has established comprehensive material characterization capabilities, including thermal conductivity, coefficient of thermal expansion (CTE), flexural strength, stress, and crystal orientation/structure analysis. Appropriate substrate specifications are selected according to different application requirements.

Multiple Metallization Processes

PGT optimizes metallization solutions through actual measurement and thermo-mechanical simulation of film structure, microstructure, stress characteristics, and other parameters. Various metallization stacks, including Ti/Pt/Au, Ti/Cu, W/Cu, and other structures, are available to support a wide range of customer chip applications.

Sample Fabrication & Rapid Validation

PGT's comprehensive in-house manufacturing capabilities enable rapid fabrication of engineering samples. From design concept to physical prototype validation, samples can be produced through internal manufacturing lines and evaluated through COS packaging and performance testing, improving first-pass validation success rates and shortening solution evaluation and qualification cycles.

Reliability Validation & Failure Analysis

Reliability evaluations for submount products and COS samples include temperature cycling, high-temperature storage, and thermal shock testing.

Through microscopic inspection, cross-sectional analysis, surface analysis, and thermal performance testing, PGT identifies failure modes and establishes traceability between failure mechanisms and corresponding materials, structures, and process parameters.

Customization Capabilities

1) At the project level, PGT conducts DFMEA based on customer application scenarios to identify critical control points and optimize product designs accordingly, enabling drop-in replacement solutions without changing customers' existing assembly processes or usage practices.

2) Based on reverse engineering and benchmarking, PGT develops targeted process innovations to address limitations of existing products, improve performance, reduce cost, or meet other specific customer requirements.