The following article is sourced from Shenzhen Technology University

On June 20, Shenzhen Technology University and Paipo Technology Co., Ltd. signed a cooperation agreement to jointly build the "Optoelectronic Packaging Joint Laboratory." The two parties will work together to overcome challenges in packaging technologies for "high heat, high voltage, and high frequency," promoting the integration of industry, academia, and research, and the industrialization process.

Zhang Lin, Director of the Shenzhen Science and Technology Innovation Bureau; Wang Hao, Deputy Director of the Industry and Information Technology Bureau of Pingshan District; Chen Qiuming, Party Secretary of Shenzhen Technology University; Liang Yongsheng, Vice President; Wu Xu, Director of the Department of Research and University-Enterprise Cooperation; Ning Cunzheng, Dean of the School of Integrated Circuits and Optoelectronic Chips; Han Yulai, Party Branch Secretary; Li Yinggang, Vice Dean; An Yi, founder and general manager of Paibo Technology Co., Ltd.; Chen Wei, co-founder; and Jia Qi, strategic investor.

In his speech, Zhang Lin stated that Shenzhen's semiconductor industry has developed rapidly in recent years. Open platforms built by universities can drive the development of industrial clusters and also cultivate the talent enterprises need. He emphasized that by joining forces with universities, companies can jointly advance the development of Shenzhen's semiconductor industry, and hopes that the cooperation between Shenzhen Technology University and Paibo Technology will become a model of school-enterprise collaboration, contributing to the rise of Shenzhen's semiconductor industry.

Chen Qiuming briefly introduced the development history and scale of SZTU, pointing out that SZTU emphasizes applied education, closely aligns with the needs of Shenzhen's "20+8" strategic emerging industries, always adheres to the concept of deep cooperation with enterprises, provides customized services through joint laboratories, and conducts scientific research centered on industry needs. He hopes that in the future, the joint laboratory can fully leverage its effectiveness, provide high-quality services to enterprises at a higher level, promote deep integration of industry, academia, and research, and help Shenzhen's industry move toward high-quality development.

Ning Cunzheng pointed out that the School of Integrated Circuits and Optoelectronic Chips has the largest faculty and research level in China, and is building cutting-edge domestic process and packaging platforms, focusing on developing optoelectronic co-packaging and optoelectronic fusion chips. He emphasized that the college will engage in in-depth cooperation with PAIPO Technology in the field of optoelectronic packaging, promoting the future of the "photonic information" industry and optoelectronic integration.

An Yi highly praised Shenzhen Technology University's research strength and talent cultivation achievements in integrated circuits and optoelectronic chips. He stated that Paibo Technology Co., Ltd. has always been committed to the research and innovation of optoelectronic packaging technology, and this collaboration with Shenzhen Technology University is a model of deep collaboration between enterprises and universities. By jointly building a joint laboratory, both parties will achieve resource sharing and complementary advantages, accelerate the industrialization of optoelectronic packaging technology, and inject new vitality into industry development.

In the presence of all attendees, both parties signed an agreement to jointly build a joint laboratory

PAPO Technology leads in solutions for chip packaging "three highs" (high heat, high frequency, high pressure), especially excelling in high-end thermal sink materials, high-power laser thermal sinking, optical communication ceramic substrates, and new energy vehicle power device substrates, covering four major fields: industrial laser, optical communication, consumer electronics, and new energy vehicles.

The establishment of the "Optoelectronic Packaging Joint Laboratory" marks an important step for Shenzhen Technology University in industry-university-research cooperation. Through deep cooperation with enterprises, the university will further enhance its research level and innovation capabilities in the field of semiconductor optoelectronic packaging, while also providing strong technical support and talent guarantees for enterprises. The two parties will collaborate on multiphysics simulation and structural design of high-power laser chip heat sinks, multiphysics simulation design and packaging testing of optoelectronic chip packaging substrates, and structural optimization design and reliability verification of optical module packaging shells, jointly overcoming key technical challenges in the optoelectronic packaging field and promoting high-quality development of the optoelectronic industry.

Contributed by | School of Integrated Circuits and Optoelectronic Chips: Zhang Ling

Editor | Party Committee Publicity Department