- Solutions for High-end LED Applications
- Polishing grade ceramic surface, reducing interface resistance
- The film adhesion is improved by chemical bonding, which is highly reliable
- The front and back sides of AuSn are controlled separately, reducing the welding difficulty
| Solution | Project | Specification | |
| Ceramic Substrate | Material | AlN | |
| Thickness | 0.15~0.4mm | ||
| Thermal Conductivity | 230W/m·K | ||
| Metal Film | Film Structure | Ti/Pt/Au | |
| Film Thickness |
Ti/Pt/Au=0.1/0.2/0.3-2.0um（Dry Etching） Ti/Pt/Au=0.1/0.2/0.3-10.0um（Wet Etching） |
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| Solder Type | AuSn | ||
| Solder Proportion | Au 75±5% Sn 25±5% (Customizable) | ||
| Thickness | 1.5~7um Customize as required | ||
| Pattern Precision | LS=20um/20um | ||
| Others | Cutting Precision | ±50um | |
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
