- Pattern Electroplating
-
1. Patterning and Electroplating Capabilities:
High precision control with multiple selectable routes, suitable for varying precision requirements in routing. -
2. Rapid Prototyping and Customization Capabilities:
Ensures stable delivery with quality assurance for large-scale production.
Supported by a professional process team for customized requirements.
Over 5 million industrial laser heat sinks and 2 million consumer laser components delivered.
Successfully passed automotive supply system mass production audits. - 3. Comprehensive Evaluation Capabilities: Supports AOI visual inspection, line spectroscopy/XRF thickness testing, and organic residue reliability testing for patterned components.
| Process Segment | Item | System | Substrate | Dimension and Thickness | Precision | Appearance Testing | Testing Capability | Prototyping Leadtime |
| Pattern Electroplating | Patterning | Dry Film |
Aluminum Nitride (AlN), Silicon Carbide (SiC), Silicon Nitride (Si₃N₄), Aluminum Oxide (Al₂O₃) Lapped Ceramic Substrate, Polished Ceramic Substrate |
Pattern Thickness: Supports up to 300 μm pattern thickness requirements Substrate Size: Maximum 138 x 190 mm |
/ | Supports AOI Inspection | 1. Pattern Dimensions: Measured using a 2D image measurement instrument with a resolution of 0.1 μm and a measurement accuracy of ±2 μm. | 4 working days |
| Laser Direct Imaging (LDI) Exposure Machine | / |
Maximum Size: 12" x 12", compatible with both square and round wafers Substrate Thickness: 0.05 - 3.5 mm |
Line Width and Spacing: 8/8 μm Alignment Accuracy: ±3 μm Data Resolution: 500 nm Stitching Error: ±1 μm |
/ | ||||
| Photoresist | / | Substrate Thickness，＞0.1mm |
Coating Uniformity: ≤ ±3% Line Width and Spacing: 8/8 μm |
/ | ||||
| Dry Etching |
Titanium/Platinum/Gold (Ti/Pt/Au) Copper (Cu) |
Customizable According to Product Requirements | Supports AOI Inspection | |||||
| Electroplating | Copper Electroplating, | Copper Surface |
Maximum Size: 6" x 6", Square Pieces Customizable Thickness with Single-Sided Thickness Control (5-800 μm) |
Thickness Uniformity: ±5% (300 μm thickness) | / | High-Temperature Baking: 350°C for 1 hour, no blistering. | ||
| Nickel Electroplating, Gold Electroplating | Copper Surface |
Maximum Size: 6" x 6", Square Pieces Customizable Thickness with Single-Sided Thickness Control (Nickel Thickness: >0.1 μm, Gold Thickness: >0.1 μm) |
Gold Thickness Uniformity: ±10% (1 μm thickness) | Supports AOI Inspection |
1. High-Temperature Baking: 350°C for 1 hour, no blistering. 2. Wire Bonding Test: Pull strength determined based on customer wire bonding results. |
