- Sealed Test Lab
-
1. Comprehensive Packaging System Capability:
In-house capabilities for high-precision eutectic bonding, gold wire bonding, COS optoelectronic testing, packaging testing, online aging, and push-pull testing.
Owned team and equipment ensure full control over the process. -
2. Failure Analysis Capability:
Leveraging expertise in packaging applications to conduct comprehensive analysis using professional tools and methods, including 8D reports, SEM, EDS, FIB, and cross-section analysis.
Provides data-driven insights to guide iterative improvements. -
3. Extensive Industry Experience:
Expertise in GaAs chip packaging, SiC chip packaging, and VCSEL chip heat sink applications.
| Process Segment | Platform | Configuration | Precision | Prototyping Leadtime |
| Packaging Platform | High-Precision Eutectic Bonding | Pulse Heating, Pressure Control, Nitrogen Protection | ±3um | 4 working days |
| Gold Wire Bonding | Mainstream High-End Welding Equipment | 1mil Gold Wire | ||
| Chip-on-Substrate (COS) Optoelectronic Testing | Temperature Stability Control: Covers multiple COS tests, including LIV, power, polarization, and wavelength. | / | ||
| Packaging Testing | Low/High Magnification Inspection, OH Testing, Warpage Measurement, Push-Pull Testing | / | ||
| Online Aging | Online Aging Power Monitoring | / |
