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Pre-Applied Gold-Tin Solder
1. High-Precision Control:
Ensures uniform thickness and composition consistency of gold-tin solder.
High batch-to-batch consistency for reliable performance.
2. Rapid Prototyping and Customization Capability:
Supports quick prototyping and tailored solutions with stable quality assurance for large-scale production.
Deep understanding of pre-applied solder in packaging applications, enabling customized adjustments to meet various packaging requirements.
Over 5 million industrial laser heat sinks and 2 million consumer laser components delivered.
Successfully passed automotive supply system mass production audits.
3. ODM Design Capability:
Equipped with an in-house packaging platform and the ability to translate customer needs into product requirements.
Provides end-to-end product iteration capabilities.
Process Segment Item System Au/Sn Ratio Thickness Uniformity Au/Sn Tolerance Solder Wicking and Flow Appearance Testing Reliability Testing Capability Prototyping Leadtime
Pre-Applied Gold-Tin Solder Supported Substrate Systems, Coating Systems, and Reliability Testing Capabilities Gold-Tin Solder 75,25 ±3% ±1.5% Controllable Supports AOI Inspection 1. Melting Test
2. Shear Test
3. Dry and Wet Crosshatch Test
4. Gold Wire and Aluminum Wire Bonding Test
5. Soldering Test
4 working days
80,20
70,30
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PGT Innovation Services Pte Ltd

 

Address:

60 Kim Seng Road, #11-06, Singapore, 239497

 

Email:

philipcheng@peppergraytech.com

 

Tel:

+65 88697218