- Lapping and Polishing
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1. Precision Processing:
Processing accuracy meets the requirements for GaAs chips and SiC chip packaging, including Cu surface TTV, roughness, and thickness.
Extensive knowledge and process control capabilities accumulated from a wide range of chip application scenarios in the factory. -
2. Comprehensive Evaluation Methods:
Equipped with advanced detection devices, primarily imported, including 3D profilometers, step height measurement instruments, and confocal spectrometers.
Covers evaluations for thickness, warpage, flatness, and roughness. -
3. Fast Prototyping and Stable Mass Production:
Reliable quality assurance for large-scale production with in-house lapping and polishing equipment.
Supported by experienced engineers specializing in lapping and polishing processes.
Customization development supported for specific needs.
Over 5 million industrial laser heat sinks and 2 million consumer laser components delivered.
Successfully passed automotive supply system mass production audits.
| Process Segment | Item | Processable Materials | Dimension | Thickness After Processing | Surface Roughness | TTV | Appearance Testing | Testing Capability | Prototyping Leadtime |
| Copper Surface Lapping and Polishing | Supported Processing Materials, Processing Capabilities, and Evaluation Capabilities | Copper Surface | Customizable According to Customer Requirements | The minimum processed thickness of copper on a 150 μm substrate can reach 20 μm | ＜50nm | ≤5um（6寸inches） | / |
1. Thickness: Measured using a confocal spectrometer with a resolution of 0.1 μm and a measurement accuracy of ±2 μm. 2. Flatness and Warpage: Measured using a 3D profilometer with a resolution of 0.1 μm and a measurement accuracy of ±2 μm. 3. Roughness: Measured using a step height measurement instrument, capable of measuring a minimum value of 10 nm. |
4 working days |
| Copper Surface | Customizable According to Customer Requirements | / | ＜20nm | ≤5um（6寸inches） | Supports AOI Inspection | 4 working days |
