- PVD Ceramic Metallization
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1. Strong Reliability
Meets automotive-grade requirements for thermal cycling tests (TC1000C, -55°C to 150°C) with no delamination of the coating.
Equipped with in-house capabilities for 350°C high-temperature baking reliability tests.
Proven track record with over 5 million units of industrial laser heat sinks shipped and 2 million units for consumer lasers.
Successfully passed mass production audits for automotive supply systems. -
2. Fast Prototyping and Stable Mass Production
Quick prototyping with stable delivery and quality assurance in mass production.
Equipped with in-house small-scale coating machines, supported by experienced coating experts for customized development.
In-house large-scale coating machines ensure stable delivery of high-volume orders. -
3. Compatibility with High-Voltage, High-Frequency, and High-Heat Applications
Supports various substrate systems such as aluminum nitride (AlN), silicon nitride (Si₃N₄), and silicon carbide (SiC) with different interface roughness levels.
Provides coating systems including titanium-copper (Ti-Cu), titanium-tungsten-copper (Ti-W-Cu), and titanium-platinum-gold (Ti-Pt-Au).
Customizable substrate dimensions, thicknesses, and coating thicknesses based on customer requirements.
| Process Segment | Item | Substrate System | Dimension | Thickness | Surface Roughness | Coating System | Coating Thickness | Reliability Testing Capability | Prototyping Leadtime |
| PVD Ceramic Metalization | Supported Substrate Systems, Coating Systems, and Reliability Testing Capabilities | Aluminum Nitride (AlN) |
1.3"*3" 2.4.5"*4.5" |
Customizable According to Customer Requirements |
1.Lapped Ceramic Substrate，Ra＜0.6um 2.Polished Ceramic Substrate，Ra＜0.05um |
1.Titanium/Copper (Ti/Cu) 2.Titanium-Tungsten/Copper (TiW/Cu) |
Customizable According to Customer Requirements |
1. Adhesion of PVD with Substrate: No blistering after baking at 350°C for 1 hour. 2. Adhesion of PVD with Electroplated Thick Copper Layer: No delamination after TC1000C (-55°C/150°C) thermal cycling. 3. Adhesion of PVD with Pre-Applied Gold-Tin Solder: No delamination in dry and wet crosshatch tests. |
4 working days |
| Silicon Nitride (Si₃N₄) |
1.4.5"*4.5" 2.138*190mm |
Customizable According to Customer Requirements | Lapped Ceramic Substrate，Ra＜0.6um |
1.Titanium/Copper (Ti/Cu) 2.Titanium-Tungsten/Copper (TiW/Cu) |
Customizable According to Customer Requirements | 4 working days | |||
| Aluminum Oxide (Al₂O₃) |
1.3"*3" 2.4.5"*4.5" |
Customizable According to Customer Requirements | Lapped Ceramic Substrate，Ra＜0.6um |
1.Titanium/Copper (Ti/Cu) 2.Titanium-Tungsten/Copper (TiW/Cu) |
Customizable According to Customer Requirements | 4 working days | |||
| Carbide (SiC) |
1.4 inch 2.6 inch |
Customizable According to Customer Requirements |
1.Lapped Ceramic Substrate，Ra＜0.6um 2.Polished Ceramic Substrate，Ra＜0.05um |
1.Titanium/Copper (Ti/Cu) 2.Titanium-Tungsten/Copper (TiW/Cu) 3.Titanium/Platinum/Gold (Ti/Pt/Au) |
Customizable According to Customer Requirements | 4 working days |
