- Solutions in Optical Communication Field (High Frequency)
- Customized product design based on customer requirements, including thermal-mechanical co-design and high-frequency signal si mulation.
- High-precision fine-line lithography capability to meet the requirements of highly miniaturized products.
- Reliable thin-film metallization with excellent long-term reliability.
- Customizable AuSn solder preforms compatible with customers' packaging processes, delivering excellent consistency and reducing assembly complexity.
| Application Scenario | Power of chip | 100G/200G EMLchip | ||
| Product Category |
1.Alumina (Al₂O₃) and Aluminum Nitride (AlN) Submounts for Datacom Modules 2.Chip Carriers for Optical Transceivers and Optical Amplifiers |
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| Product Specification | Project | Specification | ||
| Ceramic Substrate | Material | Aluminum Nitride (AIN) Multilayer Co-fired Ceramic Substrate | ||
| Surface Roughness | Ra<0.05μm | |||
| Thermal Conductivity | 170 W/(m·K) | |||
| Coefficient of Thermal Expansion (CTE) | 4.6 ppm/°C | |||
| Three‑Point Bending Strength | 400 MPa | |||
| Dielectric Constant | 8.51 GHz | |||
| Metallized Via | Tungsten (W) | |||
| Internal Conductor | Tungsten (W) | |||
| Thin-Film Circuit | Metallization Stack | Ti/Pt/Au=0.06/0.2/0.3μm~10.0μm | ||
| Minimum Line/Space | L/S=5μm/5μm | |||
| TaN Thin Film Resistor | 25Ω/▢、50Ω/▢(±5%)、T.C.R-50±50ppm/°C | |||
| AuSn Solder | 1.5~7μm±20%（75±5wt%Au）,customizable | |||
| Other | Dicing Accuracy | ±50um | ||
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
