- Ceramic Substrates Si₃N₄-DPC
- Optimized design and manufacturing processes minimize solder voids and improve product reliability.
- Verically integrated manufacturing from raw materials helps reduce production costs and provides customers with highly cost-effective solutions.
- Advanced pattern electroplating enables line width/spacing down to 8/8μm and supports high-voltage insulation testing up to 2,500V. Copper thickness can be customized from 5 to 800μm with a tolerance of +5%.
| Application Scenario | SiC & Si Chips | ||
| Solution | Ceramic Substrate | Material | Si₃N₄ |
| Thickness | 0.25-0.635mm; Tolerance:±10% | ||
| Surface Roughness Ra | 0.2-0.4μm | ||
| Thermal Conductivity | 85w/(m·K) | ||
| Flexural Strength | ≥800 MPa | ||
| Elastic Modulus | 310 GPa | ||
| Metallization | Metallization Stack | Ti/Cu/Ag | |
| Patterning Capability | Line/Space | 8μm/8μm | |
| Process | / | Ceramic Metallization，DPC | |
| Performance | Electrical Insulation | / | ≥2500 V |
| Copper Peel Strength | / | ≥1.5kg | |
| Thermal Cycling | / | TC2000 cycles, -55°C to 150°C, no delamination | |
| Sample Lead Time | Prototype Lead Time | / | 7 Working Days |
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
