- Metal Housings with Pre-Applied Solder for Industrial, Consumer & Optical Communication Applications (Gold-Free Option; Solder Deposited on Ni Surface to Replace Solder Preforms)
- Pre-positioned preformed solder eliminates the customer's solder sheet placement process and improves production efficiency.
- The solder exhibits no metal diffusion, offering a wider process window and reducing soldering difficulty.
- Solder can be deposited directly onto nickel surfaces, removing the gold plating process and significantly cutting productioncosts.
| Solution | Item | Specification | ||
| Housing | Material | Oxygen-free copper, aluminum alloy or other metals | ||
| Surface Roughness Ra | Ra0.8um | |||
| Plating Type | Electroless Nickel or Electroplated Nickel | |||
| Plating Thickness | 3~9um | |||
| Solder | Composition | Cu/Sn/Ag | ||
| Thickness | 25um (After soldering<20um) | |||
| Solder | SAC305 (customisable) | |||
| Ratios of Solder | Sn96.5+/-0.5Cu0.5+/-0.2Ag3.0+/-0.5 | |||
| Solder Melting Point (Liquidus Line) | 215~220°℃ | |||
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
