- AlN Ceramic Components for Data Communication Modules
- Next Generation Optical Submount Material Solution
- Combines excellent thermal dissipation capability with high thermal stability, effectively reducing system thermal stress
- Provides outstanding dimensional accuracy, significantly reducing optical alignment complexity.
- Supports high-reliability metallization and high-precision patterning technologies, meeting both mechanical and electrical performance requirements.
| Application Scenario | Optical Submount | ||
| Solution | Ceramic Substrate | Material | Aluminum Nitride (AIN) |
| Surface Roughness Ra | Ra0.05um-0.8um (optional) | ||
| Surface Roughness | 170 w/(m ·K) | ||
| Coefficient of Thermal Expansion (CTE) | 4.6ppm/℃ | ||
| Three‑Point Bending Strength | 400Mpa | ||
| Structural Features | Structure Type | Raised Platform /Recessed Groove/Custom Geometry | |
| Feature Position Accuracy | ±0.02mm | ||
| Feature Size Accuracy | ±0.02mm | ||
| Overall Dimensions | 1-50mm | ||
| Thickness/Relative Step Height | 0.3-3mm | ||
| Thin-Film Circuit | Metallization Stack | Ti/Pt/Au=0.06/0.2/0.3μm~10.0μm | |
| Patterning Capability | L/S=5μm/5μm | ||
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
