- Solutions for Blue-green Light Chips (High Heat)
- Configure different film structures according to different heat dissipation scenarios
- Highly customized graphic capabilities
- Define the AuSn proportion according to the customer's packaging process to reduce the difficulty of customer use
| Application Scenario | Current Carrying Condition | High | Low | |
| Chip Material | GaAs | |||
| Solution | Project | Specification | ||
| Ceramic Substrate | Material | SiC | SiC | |
| Thickness | 0.25~0.4mm | 0.25~0.4mm | ||
| Thermal Conductivity | 400W/m·K | 400W/m·K | ||
| Metal Film | Film Structure | Ti/Cu/Ni/Au | Ti/Pt/Au | |
| Film Thickness |
Cu 50±15um Au＞1um |
Ti/Pt/Au=0.1/0.2/0.3-2.0um（Dry Etching） | ||
| Solder Type | AuSn | AuSn | ||
| Solder Proportion | Au 75±5% Sn 25±5% (Customizable) | Au 75±5% Sn 25±5% (Customizable) | ||
| Thickness | 1.5~7um Customize as required | 1.5~7um Customize as required | ||
| Pattern Precision | Customizable L/S=100um/150um | Customizable L/S=20um/20um | ||
| Others | Cutting Precision | ±50um | ±50um | |
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
