- Solutions for Blue-green Light Chips (High Heat)
- Configure different membrane layer structures according to different heat dissipation scenarios.
- Highly customized graphic capabilities.
- Ratios based on customer excapsulation processes to reduce customer usage complexity.
| Application Scenario | Power of chip | Hight | Low | |
| Material of chip | GaN | |||
| Product Category |
1.Ceramic Submounts for 3D Structured Light Applications 2.High-Power LED Submounts |
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| Solution | Project | Specification | ||
| Ceramic Substrate | Material | SiC | SiC | |
| Thickness | 0.15~0.4mm | 0.15~0.4mm | ||
| Thermal Conductivity | 400W/m·K | 400W/m·K | ||
| Metallization | Compostion | TiW/Cu/Ti/Pt/Au | Ti/Pt/Au | |
| Thickness |
Cu 20±10um Au＞0.5um |
T/Pt/Au=0.1/0.2/0.3-2.0u Au>0.5umm (Dry Etching) | ||
| Solder | AuSn | AuSn | ||
| Ratios of Solder | Au 75±5% Sn 25±5% (Customizable) | Au 75±5% Sn 25±5% (Customizable) | ||
| Thickness | 1.5~7um (Customizable) | 1.5~7um (Customizable) | ||
| Pattern Precision | L/S=100um/150um (Customizable) | L/S=20um/20um (Customizable) | ||
| Others | Cutting Precision | ±20um | ±20um | |
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
