- Solutions in Optical Communication Field (High Frequency)
- Graphics customized according to customer requirements
- High precision line width and spacing capability to meet customer demand for miniaturized products
- Reliable film adhesion, with high reliability
- Double-sided AuSn, different proportions of front and back can be configured as required
| Application Scenario | Chip Power | GaAs、InP、Si | ||
| Solution | Project | Specification | ||
| Ceramic Substrate | Material | AlN/SiC | ||
| Thickness | 0.15~0.4mm | |||
| Thermal Conductivity | 170/200/230/400W/m·K | |||
| Metal Film | Film Structure | Ti/Pt/Au | ||
| Film Thickness |
Ti/Pt/Au=0.1/0.2/0.3-2.0um（Dry Etching） Ti/Pt/Au=0.1/0.2/0.3-10.0um（Wet Etching） |
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| Solder Type | AuSn | |||
| Solder Proportion | Au 75±5% Sn 25±5% (customizable) | |||
| Thickness | 1.5~7um Customize as required | |||
| Pattern Precision | LS=20um/20um | |||
| Others | Cutting Precision | ±50um | ||
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
