- Solutions in Optical Communication Field (High Frequency)
- Graphics customized according to customer requirements
- High precision line width and spacing capability to meet customer demand for miniaturized products
- Reliable film adhesion, with high reliability
- Double-sided AuSn, different proportions of front and back can be configured as required
| Application Scenario | Power of chip | GaAs/InP/Si | ||
| Product Category |
1.Alumina (Al₂O₃) and Aluminum Nitride (AlN) Submounts for Datacom Modules 2.Chip Carriers for Optical Transceivers and Optical Amplifiers |
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| Solution | Project | Specification | ||
| Ceramic Substrate | Material | AIN/SiC | ||
| Thickness | 0.15~0.4mm | |||
| Thermal Conductivity | 170/200/230/400W/m·K | |||
| Metallization | Composition | Ti/Pt/Au | ||
| Thickness |
Ti/Pt/Au=0.1/0.2/0.3-10.0 um (Wet Etching) Ti/Pt/Au=0.1/0.2/0.3-2.0um （Dry Etching) |
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| Solder | AuSn | |||
| Ratios of Solder | Au 80 ± 5% Sn 20 ± 5% (customizable) | |||
| Thickness of Solder | 1.5~7um (customizable) | |||
| Pattern Ability | L/S=5um/5um (customizable) | |||
| Other | Cutting Tolerance | ±50um | ||
- Product application
- Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
