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Solutions in Laser Radar Field (High Frequency)
Graphics customized according to customer requirements
High performance pore filling process, low inductance, to meet customer demand for high frequency applications
According to the customer use scenario, the film structure and thickness are designed to meet the stress match and achieve the optimal effect of cos
Application Scenario Chip Power 10W and Below
Chip Material GaAs
Solution Project Specification
Ceramic Substrate Material AlN
Thickness 0.25~0.4mm
Thermal Conductivity 170/200W/m·K
Metal Film Film Structure TiW/Cu/Ni/Pd/Au
Copper Thickness 50±10um
Gold Thickness Au>0.1um
Solder Type AuSn
Solder Proportion Au 73±5% Sn 27±5% (Customizable)
Thickness 1.5~7um Customize as required
Aperture 0.1~0.3mm
Pattern Precision Customizable L/S=100um/150um
Others Cutting Precision ±50um
Product application
Applications
In the automatic production line, laser cutting and welding are common processing technologies. The ceramic heat sink can effectively manage the heat of laser, ensure the stability and durability of the equipment under high-load operation, and improve the precision of cutting and welding. The laser sensor plays a key role in automatic detection. The ceramic heat sink can maintain the temperature stability of laser emitter, ensure the measurement precision in the detection process, and is applicable to dimension measurement, surface detection, etc.
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