After strict review by the industry expert group, the overall technical level of this achievement reached the international leading level and successfully completed the registration of scientific and technological achievements by the Ministry of Science and Technology, registration certificate number: 3392026Y0671.

Scientific and technological achievement registration certificate. Image: Paipo Technology

This achievement evaluation was led by the China Academy of Information and Communications Technology, a research institution directly under the Ministry of Industry and Information Technology. The evaluation process strictly followed national standards for evaluating scientific and technological achievements, and the conclusions had very high official credibility and industry recognition.

According to domestic general standards, scientific and technological achievement evaluation is divided into four levels: internationally leading, internationally advanced, domestically leading, and domestically advanced. International leading is the highest grade and is extremely difficult to obtain within the industry.

Paipo Technology's successful achievement of this highest rating fully demonstrates the company's technological innovation, process R&D, and industrialization capabilities in high-end electronic ceramic heat dissipation packaging, all of which have reached the forefront of the global industry.

High-power chip electronic ceramic thermal dissipation packaging bases are core cooling components for high-end equipment such as high-power lasers, AI optical communication modules, and embodied smart devices, directly determining the chip's operational stability and service life.

For a long time, this core sector has been monopolized by international giants such as Japan and the US, with core technologies and supply chains heavily dependent on imports, making it a prominent weakness in China's high-end electronics manufacturing sector.

Facing industry pain points and supply chain security demands, PAPO Technology has continuously invested in R&D, successfully breaking through technical barriers and achieving full domestic replacement of high-end electronic ceramic thermal dissipation packaging bases, addressing key industry shortcomings.

To address long-standing industry bottlenecks such as difficulty balancing high thermal conductivity and high adhesion, high costs for using precious metals, and insufficient precision in thick copper layer fabrication, Paipo Technology has achieved core process breakthroughs through systematic R&D innovation, comprehensively improving product performance and cost-effectiveness.

Tested by third-party authoritative institutions, the product meets national standards for core indicators such as thermal conductivity, electrical conductivity, and mechanical properties, and its technological maturity and stability fully meet the requirements for large-scale industrial promotion.

This technological achievement is not limited to the laboratory stage; it has fully realized the entire process from R&D and pilot testing to large-scale mass production, with the product officially applied in batches by several leading industrial laser companies.

Paipo Technology's products have stable performance and meet standards, fully comparable to imported products, effectively meeting the application needs of high-end manufacturing scenarios, and providing solid support for customers' supply chain security and product iteration upgrades.

The expert panel clearly stated:

Paipo Technology's project results focus on the domestic challenges of high-power chip ceramic thermal dissipation packaging bases, with core processes showing significant novelty and innovative developmentCeramic metallizationand key technologies such as the preparation of gold-tin solder, solving common technical challenges in the industry.

The results have completed the entire process from R&D and pilot testing to mass production, and the technology maturity meets the requirements for industrial promotion. It has achieved domestic replacement of high-end electronic ceramic thermal dissipation packaging bases, solving the industry's "bottleneck" pain points.

This recognition as an internationally leading authoritative recognition not only highly acknowledges Paipo Technology's technological strength and industrialization capability, but also carries multiple practical strategic values.

Paipo Technology stated that it will continue to deepen its focus on the core field of high-power chip thermal dissipation packaging, continuously increase R&D investment, promote technological iteration and achievement transformation, and support China's high-end equipment manufacturing industry with more mature and competitive domestic cooling solutions to support the independent, controllable, and high-quality development of China's high-end equipment manufacturing industry.